Obverse 12 is identified by date placement at RH and date repunching
that features initial date impressions to the south below the base of
the 1, to the north above the 0 and to the north above the 4.
Reverse L is rotated 9 degrees clockwise and has developed chips that
are located at the upper right, above the crossbar and upper right of
the crossbar of the 4.
Comments: The Reverse L
die chips develop from die cracking, with higher grade examples
exhibiting a die crack connecting the die chip located at the upper
crossbar with the die chip at the upper right of C(E)NT. The die
chips increase in size as Reverse L progresses through later die states.